Ultra Flexible Graphene Thermal Conductive Film

Model		GOFB-A		GOFB-B		Test Standard
Test Item	Unit	Value				Test Standard
Appearance	/	Flaky				Visual
Thickness	μm	40±4	80±8	40±4	80±8	ASTM D374
Density	g/cm³	＞1.9	＞1.9	＞2.1	＞2.1	GB/T 13542.2-2009
Thermal conductivity	W/m·K	≥1250	≥1250	≥1450	≥1450	IEC 60086-2-14
Thermal diffusion	mm²/s	≥760	≥760	≥810	≥810	ASTME 1461-2013
Specific heat capacity	J/g·K	0.85	0.85	0.85	0.85	ASTME 1269-2011
Folding durability	次	＞400000	＞400000	＞400000	＞400000	JISC 6471
Thermal resistance(1 atm)	℃	≤500	≤500	≤500	≤500	TG-DSC method
Layer-to-layer bond strength	gf/25mm	≥30	≥30	≥30	≥30	GB/T 2792-2014
Breaking elongation	%	＞3.5	＞3.5	＞1.0	＞1.5	GB/T 7220-2004
Elastic Young’s modulus	MPa	＜800	＜800	＜4000	＜4000	GB/T 7220-2004
Surface Roughness	μm	Ra≤1	Ra≤1	Ra≤1	Ra≤1	GB/T 7220-2004
Note: The above are standard models; specific requirements can be customized as needed.