1. Thermal conductivity is stable and reliable, with low thermal resistance;
2. Great thermal endurance, operates under -40-200℃ steadily
3. Non-toxic, odorless, non-corrosive, and environmentally friendly.
Thermal interface materials are crucial components widely used in heat dissipation systems for cooling and protecting integrated circuit chips. Morion Nanotech, leveraging its deep understanding of graphene materials and thermal fillers, has developed reliable and highly cost-effective graphene composite thermal grease to meet the stringent requirements of the electronics industry, effectively addressing challenging heat dissipation issues. This material is an ideal thermal interface solution for electronic components.
Model | TGS-10 | TGS-20 | TGS-30 | TGS-35 | TGS-40 | TGS-50 | Test Standard | ||||||
Test Item |
Unit |
Value |
|||||||||||
Appearance |
/ |
Gray paste-like substance |
|||||||||||
Density |
g/cm3 |
1.8±0.1 |
2.4±0.1 |
2.4±0.1 |
2.4±0.1 |
2.5±0.1 |
2.6±0.1 |
GB 8928 |
|||||
Viscosity (25°C) |
Pa·S |
40 |
77 |
208 |
225 |
228 |
400 |
GB/T 794-2013 |
|||||
Thermal conductivity |
W/m·K |
1.0 |
2.0 |
3.0 |
3.5 |
4.0 |
5.0 |
ASTM D5470 |
|||||
Thermal resistance |
in2·K/W |
0.183 |
0.104 |
0.078 |
0.061 |
0.068 |
0.060 |
ASTM D5470 |
|||||
Breakdown voltage |
KV/mm |
9.2 |
6.3 |
8.2 |
17.5 |
4.5 |
19.5 |
ASTM D149 |
|||||
Dielectric constant @1kHZ |
/ |
2.40 |
2.38 |
2.42 |
1.84 |
2.40 |
1.43 |
ASTM D150 |
|||||
Volume resistivity |
Ω·cm |
>1013 |
>1012 |
>1012 |
>1013 |
>1012 |
>1012 |
ASTM D257 |
|||||
Oil separation |
% |
<0.5 |
<0.1 |
<0.03 |
<0.05 |
<0.04 |
<0.2 |
SH/T 0324 |
|||||
Fugitive
constituent |
% |
<1 |
<1 |
<0.7 |
<0.6 |
<0.55 |
<0.5 |
SH/T 0324 |
|||||
Working temperature |
℃ |
-40~200 |
-40~200 |
-40~200 |
-40~200 |
-40~200 |
-40~200 |
/ |
|||||
RoHS |
/ |
Pass |
IEC 62321 |