1. The horizontal thermal conductivity can reach 1700W/m·K, exhibiting excellent temperature uniformity performance;
2. The thickness of 10-1000 μ m can be customized, and no adhesive is required between layers.
Graphene thermal conductive film/plate are thermal conductive materials produced by multi-processes technology using graphene oxide as raw material, with excellent temperature resistance and thermal conductivity. The thermal conductivity of graphene thermal conductive film is more than 4 times that of pure copper, and it has good flexibility, making it an excellent choice for thermal management applications such as heat conduction and dissipation.
Graphene thermal conductive plate inherits the characteristics of graphene thermal conductive film and has a thickness greater than 200 μm. It not only has good thermal conductivity but also can increase the heat flux within the same area, making it very suitable for various high-power and high-heat-flux applications.
Model |
GOF-B40 |
GOF-B80 |
GOF-B100 |
GOF-B200 |
GOF-B400 |
GOF-C40 |
GOF-C60 |
GOF-C70 |
GOF-C80 |
GOF-C100 |
Test Standard |
|
Test Item |
Unit |
Value |
|
|||||||||
Appearance |
/ |
Flake |
Visual |
|||||||||
Thickness |
μm |
40±6 |
80±10 |
100±15 |
200±25 |
400±40 |
40±6 |
60±8 |
70±8 |
80±10 |
100±15 |
ASTMD374 |
Density |
g/cm³ |
≥2.1 |
≥2.1 |
≥2.1 |
≥2.1 |
≥2.15 |
≥2.15 |
≥2.15 |
≥2.15 |
≥2.15 |
≥2.15 |
GB/T 13542.2-2009 |
Tensile strength |
Mpa |
≥20 |
≥20 |
≥20 |
≥20 |
≥20 |
≥20 |
≥20 |
≥20 |
≥20 |
≥20 |
ASTM F152-95(2009) |
Using temperature |
℃ |
-50~150 |
-50~150 |
-50~150 |
-50~150 |
-50~150 |
-50~150 |
-50~150 |
-50~150 |
-50~150 |
-50~150 |
IEC 60068-2-14 |
Thermal conductivity (in plane) |
W/m·k |
≥1300 |
≥1300 |
≥1300 |
≥1300 |
≥1300 |
≥1500 |
≥1500 |
≥1500 |
≥1500 |
≥1500 |
ASTM E1461-2014 |
Thermal diffusion coefficient |
mm2/s |
≥750 |
≥750 |
≥750 |
≥750 |
≥750 |
≥820 |
≥820 |
≥820 |
≥820 |
≥820 |
ASTM E1461-2013 |
Specific heat |
J/g·k |
0.85 |
0.85 |
0.85 |
0.85 |
0.85 |
0.85 |
0.85 |
0.85 |
0.85 |
0.85 |
ASTM E1269-2011 |
Heat-resistance temperature (atmospheric pressure) |
℃ |
≤500 |
≤500 |
≤500 |
≤500 |
≤500 |
≤500 |
≤500 |
≤500 |
≤500 |
≤500 |
TG-DSC method |